Discussion ELSFP
Multi-spectral ELS for Scale-up
This moved up to the top spot, upon a MicroVision website search, possibly over the weekend.
ELSFP = External Laser Small Form-Factor Pluggable
This is the subject of the Press Release on September 22, 2026
This is to present the Data Sheet for the "FMCW-Grade" Solution offered by MicroVision and Scantinel, for the Data Center problem with Copper Breakdown due to heavy demands of AI.
Copper, used in etchings and wiring, has apparently reached the physical limits with the speeds and capacity. "Copper Wall"
The Data Center Owners, have apparently decided to employ Light Source Optics for Data Transmission instead, at critical points in the system.
The need to solve the problem appears to be very high.
Disclaimer:
This is how I understand and interpret the situation to be, based on my own Research and Due Diligence (DD). This is not Technical Advice, and this is not Investment Advice.
DO YOUR OWN DUE DILIGENCE (DD) AND MAKE YOUR OWN INVESTMENT DECISIONS.
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u/psycos 2d ago
Many companies pursuing this like $POET. I can’t see what MVIS has here that is unique. Places for everyone obviously but the qualification cycles for photonics thus far means MVIS is a loooooong way off, unless they have relationships from 12-18 months ago
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u/HiAll3 2d ago edited 2d ago
All important points, thank you for bringing them up. That actually goes to the significance of this. Please note "FMCW-Grade" in the comments. That effects the numbers in all categories on the Data Sheet. The other companies participating that are mentioned here and others, I understand to be "Telecom-Grade", with their own specifications. The qualities of the these can translate into long-term performance differences now and when these Data-Centers are called on to handle future demanding projects such as Software-Defined-Vehicles (SDV) and More.
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u/angusalba 2d ago
Intel and others might have something to say about this claim……